Page 80 - libroBrevetti

Department of Engineering, ICT and Technologies for Energy and Transport Patent Title Improvements in the opƟĐĂů interconneĐƟŽn systems between signal switching circuit boards. Ref. CNR 10276 Assignee(s): CNR CNR InƐƟƚute: ITIA Main Inventor: Vito Basile Countries: EP, PCT Priority date: 26/06/2013 Abstract The invenƟon consists in an opƟcal interconnĞĐƟon circuit for backplane in high capacity ICT apparatus and related automĂƟc assembly method. The sŽůƵƟŽn is based on a planar (on the backplane or on a close parallel plane) development of the Įber ŽƉƟĐƐ ribbon paths inside a mechanical support (frame) and a controlled ĚĞĨŽƌŵĂƟŽŶ of the ŽƉƟĐal Įbers thanks to mechanical constrains embedded into the frame. The ŽƉƟĐĂl ĮďĞƌƐ ribbons are general purpose and available and all connectors are sƚĂŶĚĂƌĚŝnjĞd. The overall ŽƉƟcal interconnecƟŽn circuits are paƌƟĂůŝnjed into N independent circuits, each of which connects all cards mounted on the backplane. This ƉĂƌƟƟon has considerable advantages in terms of ease of maintenance ;ƟŵĞ and cost ƌĞĚƵĐƟŽŶͿ͘ In the Tx-Rx ĐŽŶŶĞĐƟŽŶ, ŽƉƟĐĂů ĮďĞƌƐ are not spůŝƩĞd and they always remains inside a ribbon. Background The state of the art consists of external ŽƉƟĐĂl circuits. These circuits are made in two types: Flexible circuits ;ŽƉƟĐĂl ĮďĞƌƐ are placed on a ŇĞdžŝďůĞ substrate) or ^Ɵī circuits ;ŽƉƟĐĂů ĮďĞƌƐ are assembled inside a sƟī housing). In all cases, sƚĂƌƟng from Tx connectors, all opƟĐĂl Įbers of each ribbon must be ƐƉůŝƩĞĚ and routed to the Rx connectors. Each backplane opƟcal circuit is a monolithic object. Technology The sŽůƵƟŽn is based on controlled deforŵĂƟŽŶƐ of the ŽƉƟĐĂů Įďer ribbons, using an ŽƉƟŵŝnjed layout and special components as Įbers support and proƚĞĐƟon (frame). These frames have been designed with constrains (pins, boundary walls, etc) that enforce the ribbons to take an ŽƉƟŵŝnjed posŝƟŽn. Fully auƚŽŵĂƟnjed assembly technologies, based on auƚŽŵĂƟĐ vision systems, rŽďŽƟĐs, industrial auƚŽŵĂƟon, are used for the circuit assembly. Advantages and ApplicaƟons The inveŶƟŽn ĮŶĚƐ appůŝĐĂƟon on high capacity ICT apparatus, in parƟĐƵlar for switching sƚĂƟŽŶƐ and disƚƌŝďƵƟŽn network. Moreover the assembly method can be applied to other sectors. Advantages: sinjĞ reduĐƟon compared to the state of the art; more eīecƟve produĐƟon process; modular backplanes; more Ğĸcient and cheaper system maintenance; use of commercial ŽƉƟĐĂů ĮďĞƌƐ͖ IP ƉƌŽƚĞĐƟŽn. Development stage The opƟcal interconnĞĐƟon circuit development and prototyping have been completed. The prototypes have successfully passed opƟcal tests and the ĮŶal fƵŶĐƟŽŶĂl tests are early planned. KƉƟĐĂl circuits produĐƟon have been studied and manufacturing technologies and related costs have been evaluated. The roboƟc assembly cell design is in progress. 71